ROCKY MOUNTAIN SECTION OPTICAL SOCIETY OF AMERICA
                              &
           IEEE LASERS AND ELECTROOPTICS SOCIETY


                      February Meeting

Date:  Thursday, 19 Feb. 1998
Time:  7:00 PM refreshments, 7:30 PM talk
Place: National Institute of Standards and Technology
       325 Broadway, Boulder, CO
       Room 1107


Engineering Solder for Optoelectronics Packaging and MEMS 

       Y. C. Lee
       Associate Professor
       Department of Mechanical Engineering, 
       NSF Center for Optoelectronic Computing Systems, and
       NSF Center for Advanced Manufacturing and Packaging of 
         Microwave, Optical and Digital Electronics
       University of Colorado, Boulder, CO 80309-0427
       (303)492-3393 (phone); (303)492-3498 (FAX)
       http://me-www.colorado.edu/~leeyc


Abstract:

In addition to providing electrical connections, solder is useful in the 
formation of passive, precision alignments for optoelectronics and 
microelectromechanical systems (MEMS).  Different designs have demonstrated 
micrometer-level alignment accuracies, and the aligned structures are becoming 
more and more complex. This presentation will discuss some of our research 
studies on the design of solder joints for precision assembly:

1) self-alignment for laser-to-polymer waveguide coupling
2) self-alignment for MEMS popped-up structures


Biography:

Professor Y. C. Lee is an Associate Professor of Mechanical Engineering and the 
Associate Director of the Center for Advanced Manufacturing and Packaging of 
Microwave, Optical and Digital Electronics, University of Colorado at Boulder. 
Prior to joining the University in 1989, he was a Member of Technical Staff at 
AT&T Bell Laboratories, Murray Hill, New Jersey. Dr.  Lee's research activities 
include low-cost prototyping and thermal management of multichip modules, 3-D 
packaging, self-aligning soldering, fluxless or solderless flip-chip 
connections, optoelectronics packaging, process control using fuzzy-logic models 
and microelectromechanical systems (MEMS) for mm-wave and optoelectronics. His 
teaching activities include design of mechanical components, senior design 
projects, integrated manufacturing systems, mechatronics, robotics, MEMS and 
electronic/optoelectronic packaging.  Dr. Lee received the following awards:

1) Presidential Young Investigator (National Science Foundation, 1990), 
2) Outstanding Young Manufacturing Engineer Award (SME, 1992), 
3) Outstanding Paper Award (IEEE-ECTC, 1991), 
4) Outstanding Paper Award (ASME J. of Electronic Packaging, 1993), 
5) Poster Session Best Paper Award (Govern. Micro. Appli. Conf., 1988), and 
6) Ph.D. Dissertation Fellowship, University of Minnesota, 1983-1984. 

Dr. Lee is the Associate Editor of ASME Journal of Electronic Packaging and a 
co-editor of two books on Optoelectronic Packaging (John Wiley and Sons, 1997) 
and Manufacturing Challenges in Electronic Packaging (Chapman & Hall, 1998).